Hardware Design & PCB Layout
Circuit & Multi-Layer PCB Engineering
Architected for Precision & Reliability
Professional multi-layer schematic design, impedance-controlled PCB layout in KiCad EDA, component selection, and turnkey manufacturing packages.
- Multi-layer PCB routing in KiCad with controlled 50 Ω / 90 Ω differential impedance
- Thermal management copper pours, thermal relief stitching, and component derating
- DFM (Design for Manufacturing) and DFA (Design for Assembly) verified before fabrication
- Complete production package: Gerber RS-274X, Excellon drill, CPL pick-and-place, and BOM
Technical Architecture & Signal Pipeline
End-to-end signal flow from hardware acquisition to real-time execution and application interface.
Architecture
Schematic Entry
Power tree, signal isolation & component sourcing
Mechanical
3D Clearance
STEP model export for enclosure & connector fit
Routing
Multi-Layer PCB
Impedance matching, ground planes & thermal vias
Fabrication
Production Package
Gerber RS-274X, drill, CPL & turnkey BOM
Hardware Engineering & PCB Fabrication Parameters
| Engineering Parameter | Technical Implementation Specification |
|---|---|
| Layer Capabilities | 2 to 8 Layers (standard FR-4, high-Tg, aluminum core substrate) |
| EDA Design Toolchain | KiCad EDA Professional (v7 / v8) with 3D mechanical STEP verification |
| Min Trace / Spacing | 4 mil / 4 mil (0.1 mm) trace width and isolation clearance |
| Impedance Control | 50 Ω single-ended RF antenna, 90 Ω differential USB 2.0, 100 Ω Ethernet |
| Surface Finishes | Lead-Free HASL, ENIG (Electroless Nickel Immersion Gold), OSP |
| Quality Standards | IPC-A-600 Class 2 / Class 3 design rules and automated DRC verification |
Implementation Stages
Engineered Execution & Testing Methodology
Stage 01
Schematics & Power
Regulator topologies, ESD protection, and component lifecycle checks.
Stage 02
3D Mechanical Fit
Connector heights, enclosure alignment, and thermal heat sinks.
Stage 03
Routing & DRC
Differential pairs, return current paths, and ground stitching.
Stage 04
Gerber Sign-Off
Design for manufacturing review, pick-and-place files, and BOM release.